Quote:
Originally Posted by DrKnow65
Correct Artur, hence the cracked fet
The hot plate is a great idea, I handn't found that techinque in any of the research I've done. Makes perfect sence though, heat the entire unit up (use the heatsink property of the pcb to your advantage) then deal with the individual part.
What temperature are you using? Do the other components become fragile (movable) at that temp or do you run the plate below the melting point for the solder then use some kind of local heating?
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That is simple, identify melting temperature of the solder (take a small amount and put it on heat plate while raising temperature) then use for entire board.
And, yes everything becomes loose, so carefully remove the part you do not need and put new one in. (Solder paste or Flux and solder with capillary effect will make your life easier).