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BrianG · 02.17.2007, 07:48 PM

I don't mind them stacking the boards IF they provide a heatsink between layers. Seems pointless to only cool the top layer. Sure, the heat will work it's way from the bottom to the top layer, but that's not a good design IMO. The Warriors are like this; they just stack the PCBs and heatsink the top layer. Quark does too, but at least they have a heat spreader...

Personally, I wouldn't mind them using TO-220 style cases (tabbed style) FETs. The case would be bigger, but mounting them on a heatsink would be MUCH easier and those FETs cool better since there is a metal tab connected to the sink rather than the plastic case.

Not only does increasing the number of parallel FETs increase the current capacity, it also decreases the total resistance, which decreases the voltage drop, therefore less heat.

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BrianG RC-Monster Admin Offline Posts: 14,609 Join Date: Nov 2005 Location: Des Moines, IA	02.17.2007, 07:48 PM I don't mind them stacking the boards IF they provide a heatsink between layers. Seems pointless to only cool the top layer. Sure, the heat will work it's way from the bottom to the top layer, but that's not a good design IMO. The Warriors are like this; they just stack the PCBs and heatsink the top layer. Quark does too, but at least they have a heat spreader... Personally, I wouldn't mind them using TO-220 style cases (tabbed style) FETs. The case would be bigger, but mounting them on a heatsink would be MUCH easier and those FETs cool better since there is a metal tab connected to the sink rather than the plastic case. Not only does increasing the number of parallel FETs increase the current capacity, it also decreases the total resistance, which decreases the voltage drop, therefore less heat.