Quote:
Originally Posted by BrianG
Is there a reason why FETs don't have an electrically insulated metal "insert" to help cool them? Adding a heatsink to the epoxy package definitely helps, but it IS plastic after all.
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You do not want to do that if you plan to sink lots of Amps. Current design is great for given applications and it is much easier to deal with insulation of the tabs outside the package, while utilize FET's substrate as one connector and a heatsink at the same time.
There are 7 pin Dpak packages and direct-on Fet packages which are designed to maximize heat and current transfer.
The best way is to combine high-speed heatsinking (Copper) and low-speed (Alum), then ceramic can be utilized as long as it is very thin. And I think that is the idea behind all packages.
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