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(#1)
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RC-Monster Titanium
Offline
Posts: 1,729
Join Date: Apr 2006
Location: Chicago, IL Area
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01.09.2007, 01:27 PM
Too bad they don't have a better solution to that during the MFG process.
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(#2)
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RC-Monster Admin
Offline
Posts: 14,609
Join Date: Nov 2005
Location: Des Moines, IA
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01.09.2007, 01:35 PM
Yeah, but I can see why they do it that way - to allow the boards to be removable for repair. If they made the case a little bit wider, they could use a clamping mechanism instead to allow the use of regular thermal compound (not adhesive). The tough part is making it so the board doesn't move around with bumps and vibrations. Thermal compound loses its efficiency if it gets moved around a lot once applied...
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