Quote:
Originally Posted by GriffinRU
Patrick, I am not sure that D2-Pak7 has smaller die than SO8-FL and its current ratings are not that shy. And I agree on SO8-FL vs. LFPAK's.
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No, you are right, D2Pak (To-263) has a larger die than SO8-FL, but SO8-FL has a larger die than DPAK (TO-252)
However, SO8-FL has larger silicon-footprint ratio than D2Pak
The DirectFET is a great package -- but IRF silicon sucks. (Infineon is releasing some DirectFET mosfets soon...)
Quote:
Originally Posted by GriffinRU
I do not see why software can be so complicated, 10 years ago maybe it was an art to make brushless sensoreless, today with all bells and whistles inside micro's and all the features... Cannot believe in that... Neither I have seen chinese ESC with as smooth performance as schulze...
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TRY it! It's VERY complex! If it wasn't complex, there would be a lot more companies doing this ... the hardware is (relatively) easy.
Quote:
Originally Posted by GriffinRU
Just keep wondering what kind of capacitor (size wise) you are planning to use to absorb punishment. Even 2% of 6kW would be 134.4W - that is pretty good size for capacitor...and 2% is nothing you know. Or you plan to have batteries implanted inside fet's :)
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Big ones. :)
Quote:
Originally Posted by GriffinRU
 Did somebody said something about sensors ...Hmm - > Marketing or Hype -> must be crawlers 
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Now you know WHY I get pissy about sensors. All that work I've gone through in the last year to make something that works WORSE than what we already have. Bleah.